Your future responsibilities
- Development of magnetron sputtering processes for piezoelectric nitrides (AlN, AlScN, AlXN) on wide band gap substrates (SiC, GaN) with a state-of-the-art cluster tool
- Design of layer stack and process development for seed/buffer layers and metallic electrodes
- Thin film structural and functional characterization (incl. XRD, ellipsometry, AFM, piezoelectric characterization)
- Solving thin-film deposition issues related to material selection and (co-)sputtering process parameters and take corrective actions
- Design and execution of advanced experiments, data analyses, and process improvements
- Collaborate as part of the Thin Film Technologies Research Unit and Microsystems Division in ongoing projects by performing state-of-the-art investigations on materials and thin-film technology for diverse MEMS applications and beyond
- Performing data analysis using analytical calculations, modelling, and standard statistical methods
- Generating innovative ideas to improve MEMS device performance
- Working in advanced ISO5 clean room facility
- Scientific communication, reporting of research results and drive technical innovation and IP generation
- Project management of funded research projects