Your future responsibilities
- R&D for 2.5 D silicon interposers, TSV technologies and 3D stacking
- Design, layout and microfabrication of interposers and TSVs
- Concept development, DOE planning, and characterization
- Microfabrication and backend processing in cleanroom environment
- Contributing with backend solutions to different industrial projects
- Data analysis
- Technical reporting and scientific dissemination
- Project management