Your future responsibilities
- R&D and optimizing electroplating processes for FOWLP, TSVs, Cu pillars, solder bumps, RDLs, etc..
- R&D silicon interposers, TSV technologies and 3D stacking
- Material characterization & failure analysis
- Concept development, DOE planning, and characterization
- Microfabrication and back-end processing in cleanroom environment
- Contribution of back-end solutions to various industrial projects
- Data analysis
- Technical reporting and scientific dissemination
- Project management