Your future responsibilities
As a Scientist in our research unit Heterogeneous Integration Technologies, you will take on challenging and responsible tasks in the field of advanced packaging technologies, contributing directly to the strategic goals of SAL and supporting our group.
You will lead and execute projects independently, acquirint funding, publishing results, as well as representing our research at an international level. With your technical expertise and scientific drive, you will help shape our R&D roadmap.
You will lead and execute projects independently, acquirint funding, publishing results, as well as representing our research at an international level. With your technical expertise and scientific drive, you will help shape our R&D roadmap.
- Research & development in:
- Fan-Out Wafer-Level Packaging (FOWLP)
- Through-Silicon Via (TSV) technologies
- Die stacking and microelectronic system integration
- Tool responsibility within the packaging process line
- Microfabrication and backend processing in a cleanroom environment
- Design, layout, and fabrication of electronic packages
- Data analysis and interpretation
- Technical reporting and scientific dissemination (e.g. publications, conference presentations)
- Initiating of leading new projects and collaborations with industry and public funding programs (HE, FFG, Chips JU, ...)
- Occasionally project acquisition