Your future responsibilities

As a part of our team, you will contribute to the development of innovative interconnect solutions for power electronics packaging. The research includes printing of Cu sinter pastes and integration of Cu clips as part of the interconnect assembly. 

Your responsibilities will involve the following activities: 

• Designing and integrating Cu clip as top-side interconnects 
• Developing and optimizing the printing process of Cu sinter paste for die-attach and clip-attach applications 
• Conducting experimental work to optimize interfacial bonding and joint reliability 
• Metallographic preparation of the bonded samples and material characterization using optical microscopy and SEM 
• Analyzing the electrical performance of power modules with different top-side interconnects

Your profile

• Master’s student enrolled at a university in the EU (in Physics, Materials Science, Electrical Engineering or a related field)
• Self-organised and goal-oriented working style
• Experience of failure analysis and characterisation tools (e.g. metallography and SEM)
• Knowledge of transistor measurements
• Experience in data processing and evaluation
• Good command of English (written and spoken)

Important Facts about SAL

• Duration: 6 months
• Diversified research activities with plenty of technical challenges. 
• State-of-the-art lab facilities and instruments. 
• Internal and external training opportunities for further development.
• € 4 per day food allowance in restaurants or € 2 per day in supermarkets. 
• Family & kids friendly. 
• Free coffee/milk/tea & fresh fruits. 
  
  

This position is subject to the Collective Agreement for employees in non-university research (Research CA).  For this position, we offer a monthly gross salary of EUR 1.929, paid 14 times a year.

About us

Silicon Austria Labs (SAL) is a top research center for Electronics and Software Based Systems (ESBS). At three locations (Graz, Villach, Linz), SAL is conducting research along the entire ESBS value chain in the areas of sensor systems, power electronics, intelligent wireless systems, microsystems and embedded systems to develop future-oriented solutions for industrial production, health, energy, mobility, safety and more. SAL brings together key players from industry, science and research and thus valuable expertise and know-how and conducts cooperative, application-oriented research along the value chain. Cooperative projects are co-financed by SAL and enable a fast and unbureaucratic project start. SAL is thus shaping the high-tech location Austria and Europe and developing the future 
 

Innovation is our top priority and so are our employees. We are a family-friendly company and support the compatibility of work and family as much as possible. That is why we have been awarded the Work and Family Certificate until 2026. But we are constantly working on new measures to offer our employees an environment where they feel good, healthy and motivated.

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