Your future responsibilities
To strengthen our interdisciplinary research team, we are seeking a highly motivated researcher/engineer in the field of heterogeneous integration and advanced packaging. In this role, you will work on cutting-edge technologies at the intersection of microelectronics, photonics, and RF systems, contributing to innovative developments from concept definition through fabrication and characterization. You will take an active role in challenging research and development projects and collaborate closely with industrial and academic partners.
- Conduct research and development in the field of heterogeneous integration technologies
- Design, fabricate, and evaluate advanced packaging solutions such as RF/Si/photonic interposers and co-packaged optics
- Develop technology concepts, plan Design of Experiments (DOE), and perform process and device characterization
- Carry out microfabrication and backend processing in a cleanroom environment
- Contribute backend and packaging solutions to a variety of industrial and collaborative projects
- Perform data analysis and interpretation of experimental results
- Prepare technical reports, internal documentation, and support scientific publications and presentations
- Take responsibility for project management, including coordination of tasks, timelines, and technical deliverables